Fiberglass Thermal Conductive Tape for Heat Sink pad of LED, LCD, CPU etc
Production Description
Fiberglass thermal conductive tape use glass fabric cloth as substrate and double coated with thermal conductivity pressure-sensitive adhesive. Thermal conducive tape with features of high thermal conductivity and insulation, and has flexibility, compressibility, docility, strong adhesion. Adapt to temperature range, can fill the uneven surface, can be closely and firmly fit the heat source devices and heat sink, the heat quickly transmitted.
Jumbo Roll Size: 1030mm*25/50m. (Can be Customized)
Construction
Thermal conductive PSA |
Glass fabric |
Thermal conductive PSA |
Release paper/film |
Datasheet
Item No. | Thickness(mm) | 180°Peel Strength(PSTC-101)(N/25mm) | Insulation Strength(ASTM D149)(KV) | Thermal Impedance@40PSI(AMD2240)
(C*in2/W) |
Thermal Conductivity(ASTM D22470)(W/m-k) | Temperature Range |
AHS-8110 | 0.10±10% | >13.72 | 2.22 | 0.626 | 1.20 | -20℃~+120℃ |
AHS-8115 | 0.15±10% | >13.72 | 2.55 | 0.715 | ||
AHS-8120 | 0.20±10% | >13.72 | 4.29 | 1.125 | ||
AHS-8125 | 0.25±10% | >13.72 | 5.0 | 1.196 | ||
AHS-8130 | 0.30±10% | >13.72 | 5.0 | 1.445 | ||
AHS-8150 | 0.50±10% | >13.72 | 5.0 | 2.098 |
Features
- Good thermal conductivity
- Glass fiber high temperature tape
- Flexibility, adaptability and excellent bonding strength
- Broad operating temperature range
- Various sizes available
- Heat sink thermal tape
- Stable performance, low cost
- Radiator heat tape
Application
- Maily appy on CPU, LED, PPR heat sink, microprocessor.
- Power consumption semiconductor.
- Replacing screws,fasteners and other fixed means.
- Fixing heat sink on the power supply circuit board , vehicle contarol circuilt board and package chips.
- Electronic appliances, LED lighting, hardware industry, printing industry and other manufacturing industries.