Thermosetting polyimide coverlay film for FPCB
Product Description
Polyimide coverlay film is a high-performance thermosetting converlay. After the Thermosetting Converlay is attached to the material which needs to be protected, a pressure of 5-10 MPa is applied by using a quick press at 170-185 ° C for about 30 seconds , then complete the operation.
Structure
Features
- The product is easy to use, only need a quick pressure, without curing later;
- Has good adhesion to metal, PET, PVC and other plastics;
- Has excellent electrical insulation properties;
- Environmental friendly, does not contain any heavy metal elements and halogen.
Applications
Protect flexible circuit electronic product.
Datasheet
| Physical Characteristics | Standard Values |
| Model Number | KZ_1012SE(C) |
| Carrier | Yellow PI |
| Color of Adhesive | Clear |
| Thickness（μm） | 10-12 |
| Storage Condition, exp date（℃，month） | 25℃，6 months |
| Usage Temperature（℃） | 170-185℃ |
| Usage Pressure（MPa） | 5-10 |
| Peel Strength（N/mm） | 1.2-1.5 |
